SMT Equipment & Tools
Electronic Chemical Materials
 
SMD-928S

- PID Temp. control system,temp. precision is ±1°C
- For BGA chip reball heating with reballing jig

 
  • Overview
  •     
  • Specification

HOT PLATE FOR BGA/SMD REPLACEMENT
SMD-928S

BEST CHOICE FOR BGA REPLACEMENT


Simple, Fast and Reliable Hot Plate

  • Best choice for BGA Chip Replacement Processing. Combining with fixture, it is simple and fast  to replace solder ball on chips within 3 minutes.

  • Excellent preheat effect for BGA chip before actual replacement work.

  • Built-in advanced plate-type heater: convenient and effective solution for the various soldering and desoldering work on SMD and BGA chips.

  • Optimum for PC Board preheating, multi-varied small soldering production and general  maintenance on small/middle-size PC Board. 

PID Precision Temperature Control System

  • Temperature precision is ± 1ºC

  • More accurate and stable temperature display.

  • With timer display unit to achieve the best soldering result.

  • Outstanding Safety Device: Upper cover completely protects users from any burning damage.

     

 

Main Voltage

220 ±10V AC

Plate Size

150(W)x200(L)x13(H) mm

Heater

1000W

Temp. Range

50 ºC ~ 300 ºC MAX. 400ºC

Sensor

Thermoelectric Couple K Type

Temp. Precision

Dip/Digital Setting ± 1ºC

Start-up Time

6 minutes (20 ºC to 200 ºC)

Dimension

280(D)x240(W)x170(H) mm

Weight

7.5 Kg