World No.1 fast and convenient solution for BGA Chip Replacement work.
Itcan replace various types of BGA, μBGA, and CSP.
High precision aluminum alloy structure, durable, light and efficient.
Fast and convenient to reflow solder balls on the BGA chips, one cycle only needs 30~90 seconds.
(C) 2020 FONTON INDUSTRIAL All Rights Reserved.
TEL:886-2-2290-1666 FAX:886-2-2298-2233 E-mail: firstname.lastname@example.org
No.61, Wuquan 7th Rd., Wugu Dist., New Taipei Industrial Park, New Taipei City, Taiwan